Disco

DISCO Corporation, established in 1937 with headquarters based in Tokyo, Japan, is a prominent global provider of precision processing equipment and tools. The company's core business revolves around the production of manufacturing machinery specifically tailored for the cutting, grinding, and polishing of semiconductor wafers, a critical segment in the semiconductor industry. The precision processing equipment portfolio of DISCO Corporation addresses the intricacies of semiconductor fabrication, ensuring high-quality results in semiconductor production. Alongside its machinery, DISCO also supplies a range of precision processing tools, including various blades and wheels, catering to the specific requirements of cutting, grinding, and polishing operations within the semiconductor manufacturing process. While DISCO Corporation is recognized by its corporate name rather than individual product brands, its reputation is solidly anchored in the semiconductor industry, bolstered by its advanced equipment and tools. With a significant global footprint, DISCO's products and services are distributed extensively in key markets that are home to robust semiconductor industries. These crucial markets include South Korea, Taiwan, the United States, and China, in addition to serving its domestic market in Japan. (Powered by AI)